Demonstrated the viability of thermal imaging with sub-10 nm resolution
A work published in ACS Nano shows a method that will allow to study the near-surface thermal and compositional properties of self-assembled block copolymers and thereby reveal their intrinsic driving forces, contributing to the progress of bottom-up manufacturing.
A collaboration between IBM-Zurich, Göttingen University and IMB-CNM has demonstrated the viability of thermal scanning probe microscopy to image thermal dissipation at the nanoscale with sub-10 nm lateral resolution.
The method will allow to study the near-surface thermal and compositional properties of self-assembled block copolymers and thereby reveal their intrinsic driving forces, contributing to the progress of bottom-up manufacturing. The work has been published in ACS Nano.
Thermal silicon probes have demonstrated their potential to investigate the thermal properties of various materials at high resolution. The group presents a probe-based thermal-imaging technique capable of providing sub-10 nm lateral resolution at a sub-10 ms pixel rate.
Reference article
Thermal Imaging of Block Copolymers with Sub-10 nm Resolution. Steven Gottlieb, Louis Pigard, Yu Kyoung Ryu, Matteo Lorenzoni, Laura Evangelio, Marta Fernández-Regúlez, Colin D. Rawlings, Martin Spieser, Francesc Perez-Murano, Marcus Müller, and Armin W. Knoll. ACS Nano 2021. Publication Date:May 3, 2021. DOI: https://doi.org/10.1021/acsnano.1c01820