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Institutional |
16 Dec 2024

CSIC participates in the new European pilot line to lead the advanced packaging and heterogeneous integration for electronic components

CSIC's Institute of Microelectronics of Barcelona (IMB-CNM-CSIC) is the only Spanish institution within the consortium, which aims to strengthen European technological resilience by improving semiconductor supply chains. With more than 730 million euros over the next four and a half years, the Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems is one of the largest pilot lines funded by the Chips Joint Undertaking (Chips JU) and national funding authorities of Austria, Belgium, Finland, France, Germany, Greece, Portugal, Spain, through the “Chips for Europe” initiative.