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The spin-off LightNet Carbon Capture is selected in the call CSIC COCREA
The technology-based company, from IMB-CNM and ICN2, develops new climate products such as CO2atings® and CO2rallites® from industrial and urban waste. These products can, in turn, be used in the construction sector as materials with a reduced carbon footprint, to make a passive capture of CO2 and contribute to reducing emissions in cities.
Prizes for Best Oral Presentation and Best Poster in the peer-led JPhD 2024 meeting
The JPhD2024, an event entirely organized by PhD fellows in the UAB Campus, was a great success of participation and scientific networking. Predoctoral researchers of IMB-CNM gave oral presentations and attended the posters showcase, with Carla Riera Llobet and Joel Pérez winning two of the prizes.
CSIC participates in the new European pilot line to lead the advanced packaging and heterogeneous integration for electronic components
CSIC's Institute of Microelectronics of Barcelona (IMB-CNM-CSIC) is the only Spanish institution within the consortium, which aims to strengthen European technological resilience by improving semiconductor supply chains. With more than 730 million euros over the next four and a half years, the Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems is one of the largest pilot lines funded by the Chips Joint Undertaking (Chips JU) and national funding authorities of Austria, Belgium, Finland, France, Germany, Greece, Portugal, Spain, through the “Chips for Europe” initiative.
Driving Microelectronics: success stories and perspectives from IMB-CNM
The 2nd Innovation Day: 0 Km Chips by IMB-CNM-CSIC brought together nearly 170 attendees who participated in discussions on the rapid evolution of the microelectronics sector, its current needs, and the received funding.