The spin-off FlexiiC aims to design system-on-chip (SoC) solutions applied to intelligent systems and the Internet of Things. Its mission is to democratize and reinvent the world of electronics through a revolutionary organic and flexible technology, which will enable a new generation of sensors and logic circuits processed with functional inks at low temperatures on sustainable substrates.

The Institute of Microelectronics of Barcelona will receive 25 million euros to improve its infrastructure. The project includes, among other actions, the creation of a level 2 Bioelectronics Clean Room to evaluate electronic devices under biomedical conditions.

The IMB-CNM participated in the 15th Electronic Devices Conference, held in Malaga from January 28 to 30. Sixteen people traveled and participated in both oral and poster presentations.

More than 20 members of the Institute of Microelectronics of Barcelona attended the MNE 2024 and participated in many sessions, poster presentations and talks.

On 24 January 1985, the creation of the National Microelectronics Centre (CNM) was approved, authorised by the Minister of Education and Science at the proposal of the President of the CSIC. Today we are celebrating 40 years of technological excellence at the service of society, with the CNM at its Barcelona headquarters (IMB-CNM) being a prominent player at European level with participation in two new European pilot lines and two JU chip competence centers.

The Institute of Microelectronics of Barcelona (IMB-CNM, CSIC) will hold the second Innovation Day on November 27th to promote the transfer between science and industry. Representatives from the administration, research centers, public-private organizations, and the CSIC will come together to discuss the future of the sector and the development of the semiconductor ecosystem in Spain.

CSIC's Institute of Microelectronics of Barcelona (IMB-CNM-CSIC) is the only Spanish institution within the consortium, which aims to strengthen European technological resilience by improving semiconductor supply chains. With more than 730 million euros over the next four and a half years, the Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems is one of the largest pilot lines funded by the Chips Joint Undertaking (Chips JU) and national funding authorities of Austria, Belgium, Finland, France, Germany, Greece, Portugal, Spain, through the “Chips for Europe” initiative.

The 2nd Innovation Day: 0 Km Chips by IMB-CNM-CSIC brought together nearly 170 attendees who participated in discussions on the rapid evolution of the microelectronics sector, its current needs, and the received funding.