Packaging Laboratory
The main activities of this area are addressed towards:
- Dicing silicon wafer and substrates of different materials.
- Packaging of microelectronic devices.
Dicing substrates:
- Semiautomatic Dicing machine K&S980 plus.
- Semiautomatic Dicing machine LoadPoint 3AV-14.
- Optical macro zoom microscopes.
- LatticeAx 420 Cleaving equipment for substrates downsizing
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Packaging of microelectronic devices:
- SMD, flip-chip and die bonding manual equipment.
- Manual fine wire Wedge Bonders K&S4123, K&S4500.
- Manual heavy wire Wedge Bonder K&S4127.
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- Manual fine wire Ball and Ribbon Bonder TPT HB16.
- Optical macro zoom microscopes.
- Die shear and Bond pull Tester Royce 650.
Contact person
Alberto Moreno Garriga