CONSEJO SUPERIOR DE INVESTIGACIONES CIENTÍFICAS
Instituto de Microelectrónica de Barcelona
Contact Us
Login
Home
Sobre el IMB-CNM
Equipamiento e ICTS
Investigación
Publicaciones
Colaboraciones
Ofertas empleo / tesis
D+T
Divulgación
Noticias (RSS)
Solid State Technology
I-Micronews
IEEE Spectrum
EDN
Nanotechweb
SINC
Home
Noticias (RSS)
Advanced packaging
Advanced packaging
Advanced Packaging
Mentor and Tezzaron optimize Calibre 3DSTACK for 2.5/3D-ICs
How Intel can enable a successful $200 PC in the age of the media tablet
Vishay Intertechnology enhances precision thin film chip resistor arrays
EU announces achievements of three-year power microelectronics program
Yole Developpement conducts 2.5D, 3DIC and TSV interconnect patent investigation
Sede: Campus UAB. Cerdanyola del Vallès. Barcelona. E-08193 (Españ
Tel:(+34) 93 594 7700 Fax:(+34) 93 580 1496
