Static and dynamic characterisation of power devices:

• Static and dynamic electrical behaviour with temperature.
• Infrared Internal Laser Deflection temperature measure set-up.
• Comparison and optimal choice of devices for a given application.
• Specific power circuits for device characterisation.
• Drivers for the characterisation of power MOSFET and IGBT

Development of packaging methods for electro-thermal performances improvement:

• Electro-thermal simulation and modelling.
• Power module development on IMS or DCB substrates.
• Thermal conductivity measurement set-up for packaging materials.
• Infrared thermography measurement set-up.New connection techniques for high power devices.
• Hihg temperature packaging.

Power Integrated Circuits:

• Integrated gate drive circuits for IGBT.
• CMOS compatible high voltage LDMOSFET.
• Integrated temperature and current sensors.

Development of power circuits and systems:

• Hybrid integration of drivers for high power systems.
• DC/AC converter for ultrasonic atomisation applications.
• Development of integrated bi-directional switches for matrix converters.