The main actions of this service are addressed towards: Reverse engineering characterisation Package of microelectronic devices

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EQUIPMENT AVAILABLE

Reverse engineering. Physical characterisation

• Scanning Electron Microscope (SEM)
• Automatic polishing machine with multisample head
• Automatic polishing machine with two heads suitable for microsections
• Diamond saw
• 2 optical microscopes (with micromeasurement equipment)
• Photomicroscope
• Plasma equipment for plastic and layer decapping
• Laser level technique for mechanical stress measurement

Packaging

• Automatic saw for dicing
• 2 wedge bonding machines
• SMD, flip-chip and die bonding equipment