The nanolithography capabilities of IMB-CNM are included into the Integrated Micro and Nanofabrication Clean Room.

• Electron beam lithography (EBL)
• AFM based nanofabrication
• Nanoimprint lithography

AFM microscope.

• Nanoscope IV controller and Dimension 3100 head from Veeco
• Close-loop scanner
• Modules for electrical characterization (TUNA and SCM) and thermal characterization (SThM)
• Extension for nanofabrication / nanolithography (NANOMAN)
• Sample size up to a 150 mm wafer

Electron beam lithography

- RAITH 150 (TWO) dedicated electron beam lithography system, for up to 100 mm wafers. 

- System based on a SEM LEO 1530 microscope and RAITH ELPHY PLUS  controller and software

• Beam blanker
• Sample size up to a 150 mm wafer

Nanoimprint lithography (NIL)

Obducat thermal nanoimprint system

• Sample size up to 150 mm wafers
• Maximum pressure: 80 bars and temperature up to 350 ºC

Obducat UV + thermal nanoimprint system (from ICN-CIN2)

• Sample size 50 mm wafers

NPS300 (SET) nanoimprint step and flash (UV+thermal) system

Focused Ion Beam

Zeiss 1560XB Cross Beam (from ICN-CIN2)

• Sample size up to a 150 mm wafer
• Circuit editing capability
• Nanomachining capabilities

Nanopatterning by AFM

• Nanopatterning by AFM local oxidation
• Maximum size of pattern 30 µm x 30 µm
• Minimum resolution 10 nm
• Applicable to the following surfaces:
  - silicon
  - aluminium
  - other anodizable materials

EBL nanolithography

• Lithography on PMMA
• Resolution:50 nm
• Maximum field dimension: 200 µm x 200 µm

Nanoimprint lithography

• Imprinting of polymers (100 - 300 nm thickness) on different surfaces
• Resolution from 100 nm up to 50
• Imprinting area up to 4"
• "In house" technology for mould fabrication and conditioning