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Microfluidic Modules with Integrated Solid-State Sensors for Reconfigurable Miniaturized Analysis Systems; Pablo Giménez-Gómez et al.; ACS Omega, 2019, 4 (4), pp 6192–6198. Modular microfluidic systems based on a new magnetic clamping approach, which enables both interconnection of microfluidic modules and reversible integration of solid-state sensors, is presented in this work. The system layout allows the easy assessment of the system fluidic performance by using optically transparent and low cost polymeric materials.

The3D impedimetric sensors as a tool for monitoring bacterial response to antibiotics; S. Brosel-Oliu et al.; Lab.Chip, 2019, vol.19. pp. 1436 – 1447. The developed microbial sensor based on interdigitated electrode array (3D-IDEA) impedimetric transducer was employed in a biosensing platform especially designed to monitor the bacterial response to the antibiotic ampicillin. To facilitate immobilization of bacteria within the trenches and prevent their deposition on top of the barriers an important novelty is the use of polyIJN-isopropylmethacrylamide) p(NIPMAM) microgels working as antifouling agents, deposited on top of the barriers by microcontact printing.

High-resolution mapping of infraslow cortical brain activity enabled by graphene microtransistors; Eduard Masvidal-Codina et al.; Nature Materials volume 18, pages 280–288 (2019). The paper shows that arrays of graphene microtransistors are used to record infraslow cortical brain activity. The devices may be useful for monitoring of brain physiology.

CPT1C in the ventromedial nucleus of the hypothalamus is necessary for brown fat thermogenesis activation in obesity; R. Rodríguez-Rodríguez et al.; Molecular Metabolism. Carnitine palmitoyltransferase 1C (CPT1C) is implicated in central regulation of energy homeostasis. Our aim was to investigate whether CPT1C in the ventromedial nucleus of the hypothalamus (VMH) is involved in the activation of brown adipose tissue (BAT) thermogenesis in the early stages of diet-induced obesity.

Output Power and Gain Monitoring in RF CMOS Class A Power Amplifiers by Thermal Imaging; X. Perpiñà et al.; IEEE Transactions on Instrumentation and Measurement.The viability of using off-chip single-shot imaging techniques for local thermal testing in integrated radio frequency (RF) power amplifiers (PAs) is analyzed. With this approach, the frequency response of the output power and power gain of a Class A RF PA is measured, also deriving information about the intrinsic operation of its transistors. To carry out this paper, the PA is heterodynally driven, and its electrical behavior is down converted into a lower frequency thermal field acquirable with an InfraRed lock-in thermography (IR-LIT) system. After discussing the theory, the feasibility of the proposed approach is demonstrated and assessed with thermal sensors monolithically integrated in the PA. As crucial advantages to RF-testing, this local approach is noninvasive and demands less complex instrumentation than the mainstream commercially available solutions.

Thermal Management Strategies for Low and High Voltage Retrofit LED Lamp Drivers; X. Perpiñà et al.; IEEE Transactions on Power Electronics. Several thermal management strategies for LED drivers designed for high lumen retrofit LED lamps are studied by simulation and experimentation means. Depending on the driver output, two scenarios are analyzed: Low Voltage-High Current (18V-620mA) and High Voltage-Low Current (110V-85mA). Experiments (infrared thermography and thermocouples) and multiscale simulation approaches are used to assist both the lamp and driver board thermal design, as well as the driver proper integration in the lighting system. As a result, a heatsink based on an Aluminum hollow cylinder with polymer axial fins is designed and evaluated. The heatsink assessement is carried out with an LED board, in which the LED junction temperature is modeled and extracted by monitoring the LED board backside temperature. Additional experimentation to better integrate the driver is performed aiming at reducing the contact thermal resistance between the driver and the heatsink and improving the heat removal in the driver housing by including a material with a high thermal conductivity (i.e., dry silica sand or magnesium oxide powder). The proposed solution reduces the LED junction temperature up to 18% with respect to a reference lamp, whereas both drivers depict working temperatures around or below 125°C, when a working temperature of 90°C is considered.

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