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Institute of Microelectronics of Barcelona IMB-CNM   

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MPW Model

  • Fabrication process employs stepper lithography.
  • Maximum reticle size 22 x 22 mm2.
  • Reticle replicated along the wafer at least 8 times.
  • Reticle divided in smaller cells (dies) to share cost among users.
  • All the fabrication steps are common to all users (cost efficient).

 

Imagen10

- Two standard die sizes available: M (5,5 x 5,5 mm) & L (11,0 x 5,5 mm)
- At least 20 copies of each die are delivered to the users.

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