- Fabrication process employs stepper lithography.
- Maximum reticle size 22 x 22 mm2.
- Reticle replicated along the wafer at least 8 times.
- Reticle divided in smaller cells (dies) to share cost among users.
- All the fabrication steps are common to all users (cost efficient).
- Two standard die sizes available: M (5,5 x 5,5 mm) & L (11,0 x 5,5 mm)
- At least 20 copies of each die are delivered to the users.