Nanofabrication

The nanolithography capabilities of IMB-CNM are included into the Integrated Micro and Nanofabrication Clean Room.

	AFM microscope. Nanoscope IV controller and Dimension 3100 head from Veeco Close-loop scanner Modules for electrical characterization (TUNA and SCM) and thermal characterization (SThM) Extension for nanofabrication / nanolithography (NANOMAN) Sample size up to a 150 mm wafer
	Electron beam lithography - RAITH 150 (TWO) dedicated electron beam lithography system, for up to 150 mm wafers. - System based on a FE-SEM LEO 1530 microscope and RAITH ELPHY PLUS controller and software
	Nanoimprint lithography (NIL) Obducat thermal nanoimprint system Sample size up to 150 mm wafers Maximum pressure: 80 bars and temperature up to 350 ºC NPS300 (SET) nanoimprint step and flash (UV+thermal) system
	Focused Ion Beam Zeiss 1560XB Cross Beam (from ICN-CIN2) Sample size up to a 150 mm wafer Circuit editing capability Nanomachining capabilities

Nanopatterning by AFM Nanopatterning by AFM local oxidation Maximum size of pattern 30 µm x 30 µm Minimum resolution 10 nm Applicable to the following surfaces: - silicon - aluminium - other anodizable materials
EBL nanolithography Lithography on positive and negative resists Resolution below 50 nm Up to 6 inch wafers in stich fields
Nanoimprint lithography Imprinting of polymers (100 - 300 nm thickness) on different surfaces Imprinting of polymers foils (hot-embossing) Resolution below 100 nm Imprinting area up to 4" "In house" technology for mould fabrication and conditioning
Focused Ion Beam (FIB) Nanofabrication (Ga ions): Resolution below 100 nm Gas Injection System (GIS): Pt, C, TEOS deposition & O2, F etching Electrical Characterizaction capabilities (3 nanomanipulators & feedthrough)