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The nanolithography capabilities of IMB-CNM are included into the Integrated Micro and Nanofabrication Clean Room. |
Techniques
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Equipment
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AFM microscope.
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Electron beam lithography - RAITH 150 (TWO) dedicated electron beam lithography system, for up to 150 mm wafers. - System based on a FE-SEM LEO 1530 microscope and RAITH ELPHY PLUS controller and software |
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Nanoimprint lithography (NIL)
Obducat thermal nanoimprint system
NPS300 (SET) nanoimprint step and flash (UV+thermal) system |
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Focused Ion Beam
Zeiss 1560XB Cross Beam (from ICN-CIN2)
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Processes
Nanopatterning by AFM
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EBL nanolithography
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Nanoimprint lithography
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Focused Ion Beam (FIB)
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Characterization
Topographical characterization by AFM.
- Maximum sample size: 6 '' wafer
- Maximum range of images: 30 µm (X) x 30 µm (Y) x 4 µm (Z)
- Lateral resolution (depending on surface features): 1 nm
- Vertical resolution: 0.1 nm AFM
Local electrical characterization
- Electrical current mapping of the surface (0.1 pA - 100 pA)
- Lateral resolution: 10nm
AFM local thermal characterization.
- Surface temperature mapping (From room temperature to 100 ºC ± 0.5 ºC)
- Resolution: 150 nm
SEM characterization.
- SEM characterisation of whole wafers up to 6''
- EDS detector
FIB characterization.
- FIB cross-sectioning
- TEM lamela preparation
Contact
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