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Institute of Microelectronics of Barcelona IMB-CNM   

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Micro and Nanotechnology research for you

The Clean Room IMB-CNM includes equipment for micro and nanofabrication processes mainly based on silicon technologies wafers of 100 mm, but can also operate with substrates of different materials and sizes on demand. Its structure allows flexible operation, which makes it especially suitable for R + D + i. The total area is 1500 m2. Class 100-10,000 (ISO 5-7) depending on the areas.

Microfabrication Capabilities
cvdThermal Processes and CVD

The following thermal and Chemical Vapour Deposition based processes are available:

  • > Oxidation, annealing and diffusion processes on tubular furnaces.
  • > Deposition of silicon oxides and nitrides, polycrystalline silicon and BPSG on LPCVD and PECVD systems.
  • > Deposition of high-k dielectrics on a thermal ALD system.
  • > High temperature RTP processes for SiC technology.


 Go to Thermal processes area

ion implantationIon Implantation

Two medium current ion implantation systems are available for implanting a number of species: B, P, As, N, Ar, Al, Si, Mg, O, He.


 Go to Ion Implantation area

Dry Etching

A number of dry etching (plasma-based) systems and processes are available:

  • > Reactive Ion Etching (RIE) systems for aluminum, polysilicon, silicon oxide and silicon nitride materials.
  • > Deep reactive Ion Etching (DRIE) systems for deep silicon and silicon dioxide etching.
  • > Photoresist ashing.


 Go to Dry Etching area

ion implantationMetallization

Metal thin films of a variety of materials can be deposited by Physical Vapor Deposition techniques on either DC and DC/RF sputtering systems, or on thermal and e-beam evaporation systems.


 Go to Metallization area

Microsystems Processes

Various microsystems-specific processes are available:

  • > Silicon anisotropic wet etching with alkaline solutions.
  • > Surface micromachining (sacrificial layer etching).
  • > Critical point drying for releasing micromachined structures.
  • > Lift-off etching processes.

 Go to Microsystems laboratory


The following processes are available for achieving sub-100 nm resolution:

  • > Electron beam lithography.
  • > Nanoimprint lithography.
  • > Nanoimprint Step and Flash lithography.
  • > Focused Ion Beam system.
  • > AFM lithography.

 Go to Nanofabrication area

Wet Etching

Wet etching processes consisting on isotropic chemical attacks in aqueos solution of a variety of materials.

Microelectronic fabrication cleaning processes and photoresist removal


 Go to Wet Etching area


The following systems are available for standard optical lithography:

  • > Automatic coating/developing system.
  • > Contact/proximity and double-side contact/proximity mask aligners.
  • > g-line and i-line Steppers.
  • > Mask-Less Laser Lithography (i-line).

 Go to Photolithography area



  • > Wafer dicing.
  • > Die bonding processes, including SMD and flip-chip die assembly.
  • > Wire bonding.

 Go to Packaging

Electrical Characterisation

  • > Device Characterization and parameter extraction.
  • > Parametric test of fabricated wafers.
  • > Test structure design and characterisation.
  • > Development of new measurement techniques.

 Go to Electrical Characterization

ICTS Operations Manager: This email address is being protected from spambots. You need JavaScript enabled to view it., Technology and Processes Advisor: This email address is being protected from spambots. You need JavaScript enabled to view it., Facilities and Maintenance Manager: This email address is being protected from spambots. You need JavaScript enabled to view it.
Full Review William Hill